Thermal Effects Analysis

Thermal Effect Analysis (TEA)

  • Evidence for qualitative and quantitative requirements of thermal effects and fire prevention
  • Design driver to avoid fire-related thermal effects / fire spread
  • Traceable determination of fire-relevant thermal effects


  • Perform qualitative and quantitative thermal effect analyses
  • Design consultancy regarding fire-relevant thermal effects in all development phases

High demands are placed on power electronics in automotive engineering. In addition to functional safety, this applies in particular to the safety of thermal effects. OEMs here place restrictive demands on maximum occurrence rates.

Currently there is no standard for conducting an analysis to determine the actual rates of occurrence. For the quantitative thermal effect analysis (TEA), Silver Atena has therefore developed a method that is based on physical laws and experience from aviation and automotive developments.

The analysis looks at all the thermal effects which can be caused by the device being analysed. A thermal effect occurs when jet flames emerge from the housing or a so-called hot spot arises on the outside of the housing, whose maximum temperature exceeds a specified limit.

The focus of the Silver Atena Thermal Effect Analysis is on unavoidable overcurrent events that, due to their ultrafast destructive effects, can not be prevented or controlled by functional measures. The analysis provides expected rates of thermal effects corresponding to component failure rates for FMEDAs.

Based on the result of the thermal effect analysis, the risk is assessed and the benefit of design changes assessed.

Based on the result of the thermal effect analysis, the evaluation of the risk as well as the assessment of benefit of design changes takes place.

The quantitative thermal effect analysis is an FMEDA, FTA, and DFA supplemental analysis that determines the likelihood of triggering an error chain with thermal effects relevant to component failure. The rate for the thermal effect is the product of component failure rate and the likelihood of the thermal effect relevant impact (e.g., vehicle fire).

  • Development standard DO254
  • Analytical Methods in the Design Phase (FTA, FMEA, FMECA, FMEDA)
  • Thermal Effect Analysis
  • Hardware qualification (environmental tests, life test, EMC, HAST, DO160, ABD, various group standards)
  • Power electronics (control, inverter)
  • Digital Hardware (FPGA, VHDL)
  • ECUs (from specification to series development)
  • Test systems (HIL, test benches, simulators)
  • Bus systems

Dachauer Strasse 655
80995 Munich, Germany
+49 89 189600 - 0

We offer comprehensive solutions as development partner and supplier for prototypes and small series in the area of safety-critical systems and power electronics.